Observation of wire bonding shapes
Introduction to wire bonding and other aspects of SOP (Small Outline Package) packages!
Wire bonding is a method of connecting electrodes on a semiconductor chip to package terminals using metal wires, which can be broadly categorized into ball bonding and wedge bonding methods. This document presents examples of shape observation of joints using the ball bonding method. The samples included were prepared by mechanical polishing to create cross-sections, but there are appropriate processing methods depending on the observation purpose, sample composition, and structure. At Aites, we consider and propose processing, pretreatment, observation methods, and combinations based on our accumulated know-how. Please feel free to contact us for consultations. [Observation Overview] ■ Wire bonding of SOP (Small Outline Package) packages ■ Wire bonding of LED segment display devices ■ Wire bonding of surface-mounted LEDs *For more details, please download the PDF or feel free to contact us.
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